Prof Guangming Zhang

Journal article

Chen Y, Wang Q, Zhang G, Li P, Fan Y, Wang Z, Dong M. 2024. Phase unwrapping in digital holography based on SRDU-net Optics Communications, 573 DOI Publisher Url Public Url

Chen Y, Shen H, Zhang G, Dong M, Wan X. 2024. Identification of weld defects from ultrasonic signals using GASF and an improved DCGAN-ResNet network Nondestructive Testing and Evaluation, :1-27 DOI Publisher Url Public Url

Chen Y, Fan Y, Zhang G, Wang Q, Li S, Wang Z, Dong M. 2024. Speckle noise suppression of reconstructed image in digital holography based on BM3D improved convolutional neural network Applied Optics, 63 :6000-6011 DOI Publisher Url Public Url

Lei M, Zhang X, Yang W, Wan J, Dong Z, Zhang C, Zhang G. 2024. High-Precision Drilling by Anchor-Drilling Robot Based on Hybrid Visual Servo Control in Coal Mine MDPI Mathematics, 12 DOI Publisher Url Public Url

Wang H, Zhang G, Ma H, Zhang X, Chen Y, Harvey DM. 2024. A Multiresolution Sparse Signal Representation Approach for the Decomposition of Overlapping Echoes in Complex Ultrasonic Signals Mechanical Systems and Signal Processing, 219 DOI Publisher Url Public Url

Lei M, Zhang X, Dong Z, Wan J, Zhang C, Zhang G. 2023. Locating Anchor Drilling Holes Based on Binocular Vision in Coal Mine Roadways Mathematics, 11 DOI Publisher Url Public Url

Duncan B, Al-Kassas R, Zhang G, Hughes D, Qiu Y. 2023. Ultrasound-Mediated Ocular Drug Delivery: From Physics and Instrumentation to Future Directions Micromachines, 14 DOI Author Url Publisher Url Public Url

Wang H, Zhang G, Ma H, Zhang X, Manzanera TP, Braden D, Harvey D, Salleh MAAM. 2023. Reliability and Failure Modelling of Microelectronic Packages Based on Ultrasonic Nondestructive Evaluation Data Independent Nondestructive Testing and Evaluation (NDT and E) International, DOI Publisher Url Public Url

Xue X, Wang C, Ma H, Mao Q, Cao X, Zhang X, Zhang G. 2022. Self-Derived Wavelet Compression and Self Matching Reconstruction Algorithm for Environmental Data in Complex Space of Coal Mine Roadway Energies, 15 :7505-7505 DOI Publisher Url Public Url

Baishya K, Harvey DM, Partida Manzanera T, Zhang G, Braden DR. 2022. Failure patterns of solder joints identified through lifetime vibration tests Nondestructive Testing and Evaluation, :1-25 DOI Publisher Url Public Url

Mao Q, Wang Y, Zhang X, Zhao X, Zhang G, Mushayi K. 2022. Clarity method of fog and dust image in fully mechanized mining face Machine Vision and Applications, 33 DOI Publisher Url Public Url

Yang W, Zhang X, Ma H, Zhang G, Yang G. 2021. Non-central refractive camera calibration using co-planarity constraints for a photogrammetric system with an optical sphere cover Optics and Lasers in Engineering, 139 DOI Publisher Url Public Url

Wei J, Hou X, Xu G, Zhang G, Fan H. 2021. Modeling and machining of integral impeller based on NURBS curve The International Journal of Advanced Manufacturing Technology, DOI Publisher Url Public Url

Mohamad Zaimi NS, Mohd Salleh MAA, Abdullah MMAB, Ahmad R, Mostapha M, Yoriya S, Chaiprapa J, Zhang G, Harvey DM. 2020. Effect of kaolin geopolymer ceramic addition on the properties of Sn-3.0Ag-0.5Cu solder joint Materials Today Communications, 25 DOI Author Url Publisher Url Public Url

Mao Q, Zhang Y, Zhang X, Zhang G, Fan H, Mushayi K. 2020. Accurate Fault Location Method of The Mechanical Transmission System of Shearer Ranging Arm IEEE Access, 8 :202260-202273 DOI Author Url Publisher Url Public Url

Yang W, Zhang X, Ma H, Zhang G. 2020. Laser beams-based localization methods for Boom-type roadheader using underground camera non-uniform blur model IEEE Access, :1-1 DOI Author Url Publisher Url Public Url

Dong M, Xu R-Y, Chen Y, Zhang G, Wan X. 2020. Status and prospects of ultrasonic testing for in-service shaft components of coal mine machinery JOUＲNAL OF XI’AN UNIVEＲSITY OF SCIENCE AND TECHNOLOGY, 40 :775-780

Yang W, Zhang X, Ma H, Zhang G. 2020. Geometrically-driven underground camera modeling and calibration with coplanarity constraints for Boom-type roadheader IEEE Transactions on Industrial Electronics, :1-1 DOI Author Url Publisher Url Public Url

Baishya K, Harvey DM, Zhang G, Braden DR. 2020. Investigation into how the floor plan layout of a manufactured PCB influences flip-chip susceptibility to vibration IEEE Transactions on Components, Packaging and Manufacturing Technology, 10 :741-748 DOI Author Url Publisher Url Public Url

Zhang G, Qi A, Wenhui K, Haijun L. 2019. Coal seam thickness prediction based on transition probability of structural elements Applied Sciences, 9 DOI Publisher Url Public Url

Yang W, Zhang X, Ma H, Zhang G. 2019. Infrared LEDs-based pose estimation with underground camera model for Boom-type roadheader in coal mining IEEE Access, 7 :33698-33712 DOI Publisher Url Public Url

Mao Q, Ma H, Zhang X, Zhang G. 2018. An Improved Skewness Decision Tree SVM Algorithm for the Classification of Steel Cord Conveyor Belt Defects Applied Sciences, 8 DOI Author Url Publisher Url Public Url

Qi A, Zhang G, Dong M, Ma H-W, Harvey D. 2018. An artificial bee colony optimization based matching pursuit approach for ultrasonic echo estimation Ultrasonics, 88 DOI Author Url Publisher Url Public Url

Zhang G, Wang X, Ma H-W, Zhang Y, Wang D. 2018. Measurement of 3D Ultrasonic Wavefield Using Pulsed Laser Holographic Microscopy for Ultrasonic Nondestructive Evaluation Sensors, 18 DOI Author Url Publisher Url Public Url

Dong M, Ma H, Zhang G, Chen Y, Zhang X, Cao X. 2017. A model for determining electromechanical response profile of ultrasonic transducers and ultrasonic transient echo Shengxue Xuebao/Acta Acustica, 42 :403-410 Publisher Url Public Url

Lee CS, Zhang G-M, Harvey DM, Qi A. 2016. Characterization of micro-crack propagation through analysis of edge effect in acoustic microimaging of microelectronic packages NDT & E International, 79 :1-6 DOI Author Url Publisher Url Public Url

Zhang G, Lee C, Harvey DM, Ma HW, Braden D. 2016. Finite Element Modelling for the Investigation of Edge Effect in Acoustic Micro Imaging of Microelectronic Packages Measurement Science and Technology, 27 DOI Author Url Publisher Url Public Url

Lee CS, Zhang G-M, Harvey DM, Ma H-W. 2015. Development of C-Line plot technique for the characterization of edge effects in acoustic imaging: A case study using flip chip package geometry Microelectronics Reliability, 55 :2762-2768 DOI Author Url Publisher Url Public Url

Dong M, Ma H, Chen Y, Yang P, Zhang G. 2015. A high-speed method for computing the exact solution of spatial impulse response Shengxue Xuebao/Acta Acustica, 40 :850-854

Deng W, Zhang G-M, Murphy MF, Lilley F, Harvey DM, Burton DR. 2015. Analysis of Dynamic Cantilever Behavior in Tapping Mode Atomic Force Microscopy MICROSCOPY RESEARCH AND TECHNIQUE, 78 :935-946 DOI Author Url Publisher Url Public Url

Chen Y, Ma H-W, Zhang G-M. 2014. A support vector machine approach for classification of welding defects from ultrasonic signals NONDESTRUCTIVE TESTING AND EVALUATION, 29 :243-254 DOI Author Url Publisher Url

Chen Y, Ma HW, Zhang GM. 2014. A support vector machine approach for classification of welding defects from ultrasonic signals Nondestructive Testing and Evaluation, 29 :243-254 DOI

Zhang C, Zhang G, Ye B, Liang L. 2014. Three Dimensional Motion Tracking of a Point on a Bowed Violin String Using High Speed Videography Acta Acustica united with Acustica, 100 :574-582 DOI Publisher Url

Harvey DM, Yang RSH, Braden DR, Zhang GM. 2014. Effects of component placement on solder joint through-life reliability Proceedings of the Institution of Mechanical Engineers, Part O: Journal of Risk and Reliability, DOI Author Url Publisher Url

Zhang C, Ye B, Liang L, Jia X, Zhang G. 2014. Experimental and numerical studies of violin bridge vibration mechanism Key Engineering Materials, 579-580 :536-541 DOI Publisher Url

Lee C, Zhang GM, Harvey D. 2014. An implementation of rectangular infinite absorbing boundaries for acoustic simulation NDT 2014 - 53rd Annual Conference of the British Institute of Non-Destructive Testing,

Zhang C-Z, Zhang G-M, Ye B-Y, Liang L-D. 2013. Violin Bridge Mobility Analysis under In-Plane Excitation Sensors, 13 :15290-15306 DOI Author Url Publisher Url

Yang RSH, Braden DR, Zhang GM, Harvey DM. 2012. An automated ultrasonic inspection approach for flip chip solder joint assessment Microelectronics Reliability, 52 :2995-3001 DOI Publisher Url

Zhang GM, Zhang CZ, Harvey DM. 2012. Sparse signal representation and its applications in ultrasonic NDE Ultrasonics, 52 :351-363 DOI Author Url Publisher Url

Yang RSH, Braden DR, Zhang G-M, Harvey DM. 2012. Through lifetime monitoring of solder joints using acoustic micro imaging Soldering and Surface Mount Technology, 24 :30-37 DOI Author Url Publisher Url

Zhang G-M, Harvey DM. 2012. Contemporary ultrasonic signal processing approaches for nondestructive evaluation of multilayered structures Nondestructive Testing and Evaluation, 27 :1-27 DOI Author Url Publisher Url

Zhang G-M, Harvey DM, Burton DR. 2011. Micro-nondestructive evaluation of microelectronics using three-dimensional acoustic imaging APPLIED PHYSICS LETTERS, 98 DOI Author Url Publisher Url

Zhang G-M, Braden DR, Harvey DM, Burton DR. 2010. Acoustic time-frequency domain imaging. J Acoust Soc Am, 128 :EL323-EL328 DOI Author Url Publisher Url

Zhang G-M, Harvey DM, Braden DR. 2008. Signal denoising and ultrasonic flaw detection via overcomplete and sparse representations JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 124 :2963-2972 DOI Author Url Publisher Url

Zhang G-M, Harvey DM, Braden DR. 2007. Microelectronic package characterisation using scanning acoustic microscopy NDT & E INTERNATIONAL, 40 :609-617 DOI Author Url Publisher Url

Harvey DM, Zhang GM, Braden DR. 2007. Sensing requirements for modern circuit board inspection Journal of Physics: Conference Series, 76 DOI Publisher Url

Zhang G-M, Harvey DM, Braden DR. 2006. Effect of sparse basis selection on ultrasonic signal representation ULTRASONICS, 45 :82-91 DOI Author Url Publisher Url

Zhang G-M, Harvey DM, Braden DR. 2006. Adaptive sparse representations of ultrasonic signals for acoustic microimaging JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 120 :862-869 DOI Author Url Publisher Url

Zhang GM, Harvey DM, Braden DR. 2006. Resolution improvement of acoustic microimaging by continuous wavelet transform for semiconductor inspection MICROELECTRONICS RELIABILITY, 46 :811-821 DOI Author Url Publisher Url

Zhang GM, Harvey DM, Braden DR. 2006. Advanced acoustic microimaging using sparse signal representation for the evaluation of microelectronic packages IEEE TRANSACTIONS ON ADVANCED PACKAGING, 29 :271-283 DOI Author Url Publisher Url

Zhang GM, Harvey DM, Braden DR. 2005. Improved acoustic microimaging technique with learning overcomplete representation JOURNAL OF THE ACOUSTICAL SOCIETY OF AMERICA, 118 :3706-3720 DOI Author Url Publisher Url

Zhang GM, Harvey DM, Braden DR. 2005. An improved acoustic microimaging technique with learning overcomplete representation Journal of the Acoustical Society of America, 118 :3706-3720 DOI

Zhang GM, Harvey DM, Braden DR. 2005. Ultrasonic signal interpretation improvement for detection of defects in microelectronic packages Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005, :206-213

Zhang GM, Olofsson T, Stepinski T. 2004. Ultrasonic NDE image compression by transform and subband coding NDT and E International, 37 :325-333 DOI Publisher Url

Zhang GM, Harvey DM, Braden DR. 2004. High-resolution AMI technique for evaluation of microelectronic packages ELECTRONICS LETTERS, 40 :399-400 DOI Author Url Publisher Url

Cheng L, Zhang G, Zhang S, Yu J, Shui X. 2003. Study on surface acoustic wave rotary motor Shengxue Xuebao/Acta Acustica, 28 :123-126

Cheng LP, Zhang GM, Zhang SY, Zhang ZN, Shui XJ. 2003. Theoretical simulation of a rotary motor driven by surface acoustic waves Acoustical Physics, 49 :158-162 DOI Author Url Publisher Url

Cheng LP, Zhang GM, Zhang SY, Yu J, Shui XJ. 2002. Miniaturization of surface acoustic waves rotary motor Ultrasonics, 39 :591-594 DOI Author Url Publisher Url

Zhang GM, Hou CG, Wang YW, Zhang SY. 2001. Optimal frequency-to-bandwidth ratio of wavelet in ultrasonic non-destructive evaluation Ultrasonics, 39 :13-17 DOI Author Url Publisher Url

Zhang G, Zhang S, Wang Y. 2000. Application of adaptive time-frequency decomposition in ultrasonic NDE of highly-scattering materials. Ultrasonics, 38 :961-964 DOI Author Url Publisher Url

Zhang G, Zhao M, Wang Y, Tan Y. 2000. Wavelet transform signal processing: determination of the processing parameters in ultrasonic flaw detection Shengxue Xuebao/Acta Acustica, 25 :450-454

Zhang G-M, Cheng L-P, Zhang S-Y, Yu J, Shui X-J. 2000. Surface acoustic wave rotation motor Electronics Letters, 36 :1437 -1438-1437 -1438 DOI Author Url Publisher Url

Ma H, Zhang G, Wang T, Mei L, Wang Y, Xue J. 1998. Ultrasonic nondestructive testing of braze defects Hsi-An Chiao Tung Ta Hsueh/Journal of Xi'an Jiaotong University, 32 :80-84

Zhou J, Luo D, Zhang G, Tan Y. 1997. Research on a new type optical probe Guangdianzi Jiguang/Journal of Optoelectronics Laser, 8 :344-349

Hou C, Zhang G, Zhao M, Qu L. 1997. Accurate measurement of object emissivity using infrared imaging technique Hongwai Yu Haomibo Xuebao/Journal of Infrared and Millimeter Waves, 16 :193-198

Hou C, Zhao M, Zhang G, Wang Y. 1997. Multiple-function infrared-image processing system Jiguang Yu Hongwai/Laser and Infrared, 27 :39-41

Conference publication

Harvey DM, Manzanera TP, Baishya K, Zhang G, Arif MAAMS, Chan YC, Ekere N, Braden D. 2023. Practical Study to Demonstrate an Increase in the Reliability of Flip Chip Connections by Adding Nanoparticles to Solder 24th European Microelectronics and Packaging Conference, EMPC 2023, DOI Publisher Url

Harvey DM, Zhang G, Ekere N, Manzanera TP, Mohd Salleh Arif MAA, Braden D, Baishya K, Chan YC. 2023. Practical study to demonstrate an increase in the reliability of flip chip connections by adding nanoparticles to solder Advancing Microelectronics, 2023 :119-122 DOI Publisher Url

Dlugosz M, Zhang G. 2019. Full state proportional controller for adaptive cruise control system 2019 24th International Conference on Methods and Models in Automation and Robotics, MMAR 2019, :618-624 DOI Publisher Url

Olumide AA, Baishya K, Zhang G-M, Braden DR, Harvey DM. 2018. Non-destructive Evaluation and Life Monitoring of Solder Joints in Area Array Packaging 2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 7th Electronic System-Integration Technology Conference (ESTC) DOI Author Url Publisher Url

Qi A, Fu J, Zhang G. 2017. Application of basis pursuit in signal denoising of ultrasonic testing flaw 1st International Conference on Electronics Instrumentation and Information Systems, EIIS 2017, 2018-January :1-5 DOI Publisher Url

Qi A, Fu J, Zhang G. 2017. Application of Basis Pursuit in Signal Denoising of Ultrasonic Testing Flaw Li JB. PROCEEDINGS FIRST INTERNATIONAL CONFERENCE ON ELECTRONICS INSTRUMENTATION & INFORMATION SYSTEMS (EIIS 2017), 1st International Conference on Electronics Instrumentation & Information Systems (EIIS) :57-61 Author Url

Harvey DM, Zhang GM, Braden DR, Baishya K. 2016. Real World Modelling of Circuit Board Assemblies to help inform prognostic predictions IEEE ESTC 2016 DOI Author Url Publisher Url

Yang RSH, Harvey DM, Zhang G-M, Braden DR. 2012. Fusion of Acoustic and X-ray Image Features for Solder Joint Through-life Monitoring during Thermal Cycling Tests 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 4th Electronic System-Integration Technology Conference (ESTC) DOI Author Url Publisher Url

Lee C, Zhang G-M, Harvey D. 2012. Analysis of Solder Joint Edge Effect in Acoustic Micro Imaging of Microelectronic Packages: A Preliminary Study 2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 4th Electronic System-Integration Technology Conference (ESTC) DOI Author Url Publisher Url

Braden DR, Yang RSH, Duralek J, Zhang G, Harvey DM. 2012. Component layout influences on solder joint reliability studied using through life inspection techniques Electronic System-Integration Technology Conference (ESTC), 2012 4th, Electronic System-Integration Technology Conference (ESTC), 2012 4th :1-6 DOI Author Url Publisher Url

Yang RSH, Harvey DM, Zhang GM, Braden DR. 2010. Reliability of solder joints assessed by acoustic imaging during accelerated thermal cycling Electronics System Integration Technology Conference, ESTC 2010 - Proceedings, DOI Publisher Url

Braden DR, Yang RSH, Duralek J, Zhang GM, Harvey DM. 2010. Investigation into the impact of component floor plan layout on the overall reliability of electronics systems in harsh environments Electronics System Integration Technology Conference, ESTC 2010 - Proceedings, DOI Publisher Url

Zhang G, Harvey DM, Bradeno DR. 2008. Ultrasonic Flaw Detection Using Sparse Representation for Failure Analysis of Next Generation Microelectronic Packages ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2nd Electronics System-Integration Technology Conference :1045-+ DOI Author Url Publisher Url

Zhang G-M, Harvey DM, Braden DR. 2008. Sparse deconvolution of ultrasonic NDE traces - a preliminary study 2008 IEEE ULTRASONICS SYMPOSIUM, VOLS 1-4 AND APPENDIX, IEEE Ultrasonics Symposium :176-+ DOI Author Url Publisher Url

Harvey DM, Zhang GM, Baishya K, Braden DR. Toolbox for 3D Imaging of Manufactured Electronic Circuits IEEE ESTC 2016 DOI Author Url Publisher Url Public Url

Chapters

Zhang G, Wang Y, Zhang S, Zhang B. 2002. Ultrasonic NDE Using Instantaneous Phase Information Via Morlet Wavelet Transform Halliwell M, Wells PT. Acoustical Imaging :197-202 Springer US 978-0-306-46516-1 DOI Author Url Publisher Url

Media Coverage:

Website of the British Council (Japan) 2021

the Engineer

Research Grants Awarded:

COP26 Trilateral Research Initiative grant by the British Council, Go-GREEN: Next Generation Solder Materials for Power Electronics and Green Electric Transport, Grant value (£): 50000, Duration of research project: 1year. 2021

Marie Skłodowska-Curie Actions (MSCA): Research and Innovation Staff Exchange (RISE), Reliable electronics for tomorrow’s active systems, Grant value (£): €777,400, Duration of research project: 4 years. 2020

EPSRC standard grant (EP/G004358/1), Super resolution acoustic time-frequency domain imaging techniques for the 3D evaluation of next generation microelectronic packages and systems, Grant value (£): 201,873, Duration of research project: 2 years. 2018

Newton Fund Institutional Links Grant (Grant ID: 332397914), Green electronics: sustainability in modern electronics manufacture by improving the environmental resilience through introduction of novel materials forensically analysed for future reliability, Grant value (£): 149796, Duration of research project: 18 months. 2018

National Natural Science Foundation of China grant (Grant No. 61674121), Study on diagnosis of embedded flaws in modern IC packages using scanning acoustic microscopy, Grant value (£): 78000, Duration of research project: 4 years. 2017

EU TETRACOM grant, IP DIME: Image processing to detect hidden defects in manufactured electronics systems, Grant value (£): €124,000, Duration of research project: 1 year. 2015

EU TETRACOM grant, 3DAP-TIME: 3D acoustic processing to inspect manufactured electronics, Grant value (£): €65,000, Duration of research project: 8 months. 2014

IeMRC Doctoral Training Award grant (set up and supported by EPSRC), Fusion of ultrasound & X-ray data for inspection of modern microelectronic packages, Grant value (£): 30000, Duration of research project: 3 years. 2009

Conference organisation:

15th Global Congress on Manufacturing and Management (GCMM2020), Member of organizing committee. 2020

Asia Pacific Conference of the Prognostics and Health Management Society 2019, Member of organizing committee.

International Conference on Material Engineering and Advanced Manufacturing Technology, Member of Technical Committee.

International Conference on Sensor Device Technologies and Applications, Member of Technical Committee.

International Conference on Microelectronic Devices and Technologies, Member of Technical Committee.

Fellowships:

Member, The Institution of Engineering and Technology. 2019

Award:

Gold Medal award in ‘2018 Hong Kong International Invention and Design Competition. 2018

Visiting professor, Xi’an University of Science and Technology. 2013

Visiting professor, Xi’an University of Post and Telecommunication. 2012

Editorial boards:

Journal of Materials Science: Advanced Composite Materials, Editorial board member. 2018

Sensors, Special issue editor, https://www.mdpi.com/journal/sensors/special_issues/mlspas_sensors.

Membership of professional bodies:

Fellow, the Higher Education Academy. 2014